Engineer II - Mixed Signal Integration and Test
ESSENTIAL JOB FUNCTIONS: Work with engineering and research staff to characterize advanced microelectronic assemblies containing components such as custom mixed signal integrated circuits, high density interconnect printed circuit boards (PCBs), multilayer ceramic and organic single-chip and multi-chip packages, and interposers for high frequency (>1 GHz) applications. Support testing with assembly (e.g. wirebonding, chip attach, etc.) as needed. Assist the team in design for testability and other related design and analysis. Develop customized test setups, develop test acquisition software, and perform data acquisition and subsequent analysis. Troubleshoot complex test setups to ensure proper operation. Work closely with other domain experts performing related functional design and analyses (e.g. circuit design, signal integrity / power integrity analysis, PCB design, etc.). Maintain awareness of state-of-the-art test methods, and develop new or modified test methods as needed to support emerging needs. Present details of work to colleagues during project meetings. Create and manage work plans to meet or exceed schedule deadlines. Provide written and oral summaries of work performed as needed for reports.
EXPERIENCE DESIRED: Significant experience with high speed RF/microwave and digital test and measurement techniques including vector network analysis (VNA), spectrum analysis, time domain reflectometry/transmission (TDR/TDT), real-time and sample oscilloscopes, bit error rate (BERT). Desire experience with microelectronic assembly and printed circuit board design / assembly (e.g. soldering). Familiarity with RF design practices (e.g. controlled impedance transmission lines, crosstalk minimization, signal integrity, power integrity, electromagnetic simulations), thermal/mechanical design considerations, and/or 3D CAD design tools (e.g. Solidworks) would be a plus.
KNOWLEDGE DESIRED: Familiarity with fundamental theory of operation of test equipment mentioned above (e.g. VNA calibration). Knowledge of fundamental electrical engineering and circuit design principles. Knowledge of fundamental microelectronic packaging test procedures and equipment (particularly RF measurements such as VNA and TDR). Use of Microsoft Office tools (Word, Excel, Powerpoint) and proficiency in writing for reporting.
ESSENTIAL PHYSICAL/MENTAL REQUIREMENTS: Proficiency in use of computers, engineering work stations, complex electronic equipment, oral and written communication, interaction with vendors/colleagues and willingness to work in a fast-paced, deadline-driven environment. Ability to work well in a team and independently. Must be sufficiently mobile to work within confined spaces and have both visual and hearing acuity.
SPECIAL REQUIREMENTS (e.g. driver’s license special tools or restrictions): U.S. citizenship is required. Must be able to obtain and maintain a security clearance. Active SSBI is a plus.
We are proud to be an EEO/AA employer M/F/D/V. We maintain a drug-free workplace and perform pre-employment substance abuse testing.
- Pay Type Salary
- Malibu, CA, USA