Engineer VI– Mixed Signal System Design and Analysis – Signal Integrity and Electromagnetic Effects
ESSENTIAL JOB FUNCTIONS: Lead technical teams (and contribute directly) working on design and analysis of signal integrity (SI) and electromagnetic (EM) effects in highly complex high frequency (>1 GHz), high dynamic range (>80 dB) mixed signal systems in an innovative research and development environment. Perform analytical studies of electronic systems and both active and passive components thereof (integrated circuits, chip-level packaging, interposers, printed circuit boards, connectors, power delivery components, etc.) to support design tradeoffs. Design and analysis activities include electromagnetic modeling, driver/receiver circuit design and related analysis (e.g. SSN, ISI, crosstalk, EMC/EMI), power delivery network design and analysis, packaging parasitic estimation. Lead associated design, testing and verification efforts to ensure measured results meet desired design targets, and to continually improve simulation-measurement correlation. Develop new test and simulation methods as necessary to support the above activities when demands exceed the state of the art. Create new design strategies where possible to support functional requirements while meeting SI and EM goals. Work closely with other domain experts performing related functional analyses (e.g. packaging design and analysis, circuit design, thermal/mechanical analysis, etc.). Coordinate related technical team activities. Present details of work to colleagues during design reviews. Create and manage work plans to meet or exceed schedule deadlines. Provide written and oral summaries of work performed as needed (e.g. for reports).
EXPERIENCE DESIRED: More than 10 years experience with a wide range of CAD / simulation tools to support design and analysis (e.g. HFSS, CST Studio, Sonnet, ADS, HSPICE, SI-Wave, Sigrity). More than 7 years experience with high frequency measurement techniques (VNA, TDR) for characterizing various interconnect features such as insertion loss, return loss, impedance, and crosstalk. Experience with high speed oscilloscopes (both real-time and sampling) and other time domain instruments (e.g. BERT) for analog and digital signal characterization. Familiarity with packaging technology (e.g. ceramic and laminate chip-level packages, printed circuit boards, interposers, etc.) is a plus.
KNOWLEDGE DESIRED: Deep understanding of electromagnetic theory, transmission line theory, network analysis, and high speed measurement, calibration, and de-embedding techniques. Familiarity with circuit-level operation and related theory of common electrical signaling methods (e.g. CML, LVDS, HSTL, SST). Knowledge of fundamental electrical engineering and circuit design principles. Use of Microsoft Office tools (Word, Excel, Powerpoint) and proficiency in writing for reporting.
ESSENTIAL PHYSICAL/MENTAL REQUIREMENTS: Proficiency in use of computers, engineering work stations, complex electronic equipment, oral and written communication, interaction with vendors/colleagues and willingness to work in a fast-paced, deadline-driven environment. Ability to work well in a team and independently. Must be sufficiently mobile to work within confined spaces and have both visual and hearing acuity.
SPECIAL REQUIREMENTS (e.g. driver’s license special tools or restrictions): U.S. citizenship is required. Must be able to obtain and maintain a security clearance. Active SSBI is a plus.
We are proud to be an EEO/AA employer M/F/D/V. We maintain a drug-free workplace and perform pre-employment substance abuse testing.
- Pay Type Salary
- Malibu, CA, USA