Section Leader - Advanced Microelectronic Packaging
Bachelor or Master’s degree in Electrical Engineering, Mechanical Engineering, Chemical Engineering or Material Sciences.
ESSENTIAL JOB FUNCTIONS:
Lead a team of 4 to 6 engineers in the field of advanced microelectronic packaging. Job functions will include: mentoring staff members in technical excellence; allocating resources and prioritization of assigned work; working with program managers to define HRL’s advanced packaging roadmap; leading capital acquisition projects; developing new processes for improved performance, quality, or cost; maintaining existing processes; planning and performing experiments; recording, analyzing data, and presenting results; communicating future research options and recommendations to HRL program managers.
5+ years’ experience in semiconductor microelectronic packaging process design and material development in a hands-on role. Expert in 2.5D and 3D packaging assembly processes including die-to-wafer bonding, wafer-to-wafer bonding, surface mount, die prep, die attach, flip chip, under-filling, wire bonding, singulation and back-end processes. 3+ years’ experience in microelectronic fabrication (Dry and wet etch, lithography, metal and dielectric deposition, plating, and chemical and mechanical polishing (CMP)), materials characterization and analysis, DOE, reliability standards and FA techniques.
Experience leading others is preferred, either in a project leadership role or in a direct line management role. Proven track record of collaborating across organizational boundaries, demonstrating ownership, demonstrating a high quality standard, track record of driving projects to conclusion, and experience achieving similar results through others.
Expert level knowledge of semiconductor microelectronic packaging processes, equipment, materials and industry trends. Processes associated with semiconductor IC fabrication is beneficial, specifically relating to semiconductor back end of line (BEOL) processing; Knowledge of basic statistical process control and/or design of experiments principles is beneficial. Use of Microsoft office programs, standard data processing and analytical tools, and standard scientific software programs is required. Basic understanding of RF and microwave engineering is a plus. Familiarity with thermo-mechanical software as well as cadence or other layout tools is a plus;
ESSENTIAL PHYSICAL/MENTAL REQUIREMENTS:
Proficiency in use of computers, engineering work stations, complex electronic equipment, verbal and written communication, interaction with customers/colleagues and willingness to work in a fast-paced, deadline-driven environment. Must be sufficiently mobile to work within confined spaces and have both visual and hearing acuity. Must be able to work within a class 10 Cleanroom. Must be able to work safely with and around potentially toxic and hazardous materials, chemicals and gases.
SPECIAL REQUIREMENTS (e.g. driver’s license, special tools or restrictions): U.S. citizenship or permanent resident status required.
We are proud to be an EEO/AA employer M/F/D/V. We maintain a drug-free workplace and perform pre-employment substance abuse testing.
- Pay Type Salary
- Malibu, CA, USA