Scientist V: Advanced Packaging and Subsystem Integration
ESSENTIAL JOB FUNCTIONS: Contribute technical expertise and work within a fast-paced team of scientists and engineers for developing novel packaging and subsystem integration such as advanced 2.5D and 3D microelectronic packaging concepts and multi-chip modules for next generation high-speed and RF/mmW applications based on silicon (CMOS/BiCMOS/SOI), III-V (GaAs, InP, GaN), and exotic materials; novel device technologies, passives, RF MEMS and Photonic components. The research staff member will support and eventually lead all aspects of 2.5D and 3D integration technology development, test and evaluation. This potentially includes initial design concept, thermal, mechanical, and electrical (DC and RF) analysis and optimization, clean room process development, manufacturing feasibility on die, substrate and assembly. Additional job functions involve publishing papers, writing invention disclosures, attending scientific meetings, interacting with customers, preparing reports and briefings, participating in new concept development and contributing to proposal and marketing efforts required to sustain continued R&D efforts.
EXPERIENCE DESIRED: 3+ years experience with 2.5D and 3D microelectronic packaging, multi-chip module and heterogeneous integration. Hands-on nano/microelectronics semiconductor fabrication (DRIE, RIE, wafer bonder, die attaching, lithography, ALD, PECVD, plating, CMP etc) and back end of line (BEOL) processing. Experience with thermal, mechanical and electromagnetic software. Experience in thermal, mechanical, electrical and environmental characterization. Experience with fine scale assembly and new material development will be a plus. Candidates should possess a proven track record of developing novel and successful solutions to complex technical issues.
KNOWLEDGE DESIRED: Familiarity with heterogeneous integration fabrication processes as well as semiconductor back end of line (BEOL) processing. Knowledge of multi-physics simulation tools (ANSYS, COMSOL), high frequency and RF simulation tools (ADS, MWO), electromagnetic simulation tools (ANSYS HFSS) and 3D CAD mechanical drawing environment. Working knowledge of microelectronic packaging test equipment. Knowledge of basic statistical process control and/or design of experiments principles.
ESSENTIAL PHYSICAL/MENTAL REQUIREMENTS: Proficiency in use of computers, engineering work stations, complex electronic equipment, verbal and written communication, interaction with customers/colleagues and willingness to work in a fast-paced, deadline-driven environment. Must be willing to travel and ability to work well in a team and independently. Must be sufficiently mobile to work within confined spaces and have both visual and hearing acuity. Must be able to work within a class 10 Cleanroom. Must be able to work safely with and around potentially toxic and hazardous materials, chemicals and gases.
SPECIAL REQUIREMENTS (e.g. driver’s license special tools or restrictions): U.S. citizenship is required. Ability to obtain a security clearance is desired.
We are proud to be an EEO/AA employer M/F/D/V. We maintain a drug-free workplace and perform pre-employment substance abuse testing.
- Pay Type Salary
- Malibu, CA, USA